Power chips are connected to external circuits through product packaging, and their efficiency depends upon the assistance of the product packaging. In high-power circumstances, power chips are generally packaged as power modules. Chip interconnection describes the electric connection on the top surface of the chip, which is typically light weight aluminum bonding cord in standard components. ^
Typical power component package cross-section
At present, industrial silicon carbide power components still mainly use the product packaging technology of this wire-bonded traditional silicon IGBT module. They encounter troubles such as huge high-frequency parasitic parameters, not enough warm dissipation capability, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The display of superb efficiency. In order to solve these troubles and fully exploit the massive prospective benefits of silicon carbide chips, lots of brand-new packaging modern technologies and services for silicon carbide power components have emerged in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually developed from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold wires to copper cords, and the driving force is expense reduction; high-power tools have actually established from aluminum cables (strips) to Cu Clips, and the driving force is to enhance product efficiency. The better the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared to conventional bonding packaging approaches, Cu Clip technology has the following advantages:
1. The link in between the chip and the pins is made from copper sheets, which, to a certain extent, replaces the standard cord bonding approach in between the chip and the pins. For that reason, a distinct package resistance worth, higher present flow, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can fully conserve the expense of silver plating and bad silver plating.
3. The product look is totally consistent with normal products and is primarily utilized in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and various other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding technique is extra expensive and complex, but it can attain far better Rdson and much better thermal results.
( copper strip)
Copper sheet plus wire bonding approach
The resource pad utilizes a Clip approach, and eviction utilizes a Wire technique. This bonding technique is slightly more affordable than the all-copper bonding approach, saving wafer location (appropriate to extremely little entrance locations). The procedure is easier than the all-copper bonding method and can obtain better Rdson and much better thermal effect.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper strip for earthing, please feel free to contact us and send an inquiry.
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